YCS Mobile BGA Reballing Stencils for iPhone Android Phones CPU Chip Chips & Components AY A108 iPhone X/11/12/13/14/15/16 Pro

AY A108 iPhone X/11/12/13/14/15/16 Pro Max Dot Matrix No-soldering Non-disassembly Face ID Repair Tag-on Cable Solution

Easy UFS EMMC UFS ISP kit: including encryption chip

Voltage detection - NCV no-touch voltage detection : Built in high sensitive voltage probe

with fixed magnification mechanism and magnification limit function design

makeup table

YCS Mobile BGA Reballing Stencils for iPhone Android Phones CPU Chip Chips & Components AY A108 iPhone X/11/12/13/14/15/16 ProYCS Chip Repair Soldering Stencil is made of imported alloy steel, possessing superior flexibility and high temperature resistance. It ensures precise mesh alignment and long term durability, making it suitable for BGA soldering repair of mobile phone chips, especially for soldering CPUs and GPUs in Apple iPhone 6 17 Pro Max and Android Phone series. Features: 1. High Precision: Each mesh is calibrated according to the original manufacturer's