SKU: 65425777432
Ships within 48 hours · Estimated delivery Sep 15 - Sep 20
T-Mobile Ascend G312
Identification of external expansion boards (UFS
SIMP (SIM Personalization) code
Input Voltage: AC 110V / AC 220V
Huawei smartphones
MiJing CH5 Motherboard Layered Platform For iPhone X-12 Pro Max Phone USB Charging T-Mobile Ascend G312Mijing CH5 Intelligent motherboard preheating layered desoldering platform with CH5 CH5 BC CH5 E mold for iPhone X 12 Pro Max motherboard disassembly. Mijing CH5 motherboard heating separating welding platform for iPhone 12 11 X series PCB mainboard layering. Function: 1. Preheating platform for iPhone X XS XS Max 11 11 Pro 11 Pro Max 12 12mini 12 Pro 12 Pro Max motherboard layering, support CPU chip, HHD Nand flash, Baseband, glue removal. 2. Precise
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US$ 1650.00
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