SKU: 44141179967
Ships within 48 hours · Estimated delivery Oct 23 - Oct 28
Packing Size: 370*220*170 mm
Have eliminate static design
Most JC Pro1000S modules and V1S/V1SE boards can be used on the V1S PRO Programmer
Huawei FIG-TL10 [Huawei Figo]
accurate and stable temperature
WL BGA Reballing Stencil Kit With Positioning Mold For iPhone X-12promax Cleaning Tool Packing Size: 370*220*170 mmWL high accuracy BGA Reballing Stencil template for iphone 5S 6 6S 7 8 X XS MAX 11,11Pro,11 Pro Max,12,12Pro,12 Pro Max NAND and Baseband Soldering Repair, WL High Quality BGA Reballing Stencils kit come with Black Positioning Mold, WL High Quality Soldering BGA Reballing Stencil With Fixed Plate. Specifications: Material: High end Imported Steel Mesh Color: As Picture Shows Type: High Precision Ball Planting Net Model Number: WL High Quality Tin
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